TY - JOUR
T1 - Filler-dependent changes in thermal, dielectric, and mechanical properties of epoxy resin nanocomposites
AU - Nagase, Emiri
AU - Iizuka, Tomonori
AU - Tatsumi, Kohei
AU - Hirai, Naoshi
AU - Ohki, Yoshimichi
AU - Yoshida, Shigeyoshi
AU - Umemoto, Takahiro
AU - Muto, Hirotaka
N1 - Funding Information:
This work was partly supported by a project, Innovation Program for Energy Conservation Technologies (JPNP12004), of New Energy and Industrial Technology Development Organization (NEDO). We also thank Keigo Mori for sharing his experimental results with us.
Publisher Copyright:
© 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.
PY - 2021/1
Y1 - 2021/1
N2 - We added nanofillers of MgO, Mg(OH)2, SiO2, and TiO2 to epoxy resin by high-pressure shearing at a content of 1 vol%. The glass transition temperature (Tg), dielectric properties, and mechanical properties were measured for these nanocomposites. As a result, Tg decreases in all the nanocomposites. When the filler is MgO or Mg(OH)2, the increase of the real part (ϵr′) and that of the imaginary part (ϵr″) of complex permittivity are significantly suppressed at high temperatures by the filler loading. On the other hand, when the filler is SiO2 and TiO2, the suppression of the increase in ϵr′ and ϵr″ is not obvious. Furthermore, regardless of the filler material, the addition of nanofiller hardly affects the mechanical storage modulus at 200°C. These results indicate that the difference in filler material gives more significant effects on dielectric properties than on mechanical properties.
AB - We added nanofillers of MgO, Mg(OH)2, SiO2, and TiO2 to epoxy resin by high-pressure shearing at a content of 1 vol%. The glass transition temperature (Tg), dielectric properties, and mechanical properties were measured for these nanocomposites. As a result, Tg decreases in all the nanocomposites. When the filler is MgO or Mg(OH)2, the increase of the real part (ϵr′) and that of the imaginary part (ϵr″) of complex permittivity are significantly suppressed at high temperatures by the filler loading. On the other hand, when the filler is SiO2 and TiO2, the suppression of the increase in ϵr′ and ϵr″ is not obvious. Furthermore, regardless of the filler material, the addition of nanofiller hardly affects the mechanical storage modulus at 200°C. These results indicate that the difference in filler material gives more significant effects on dielectric properties than on mechanical properties.
KW - complex permittivity
KW - conductivity
KW - dynamic viscoelasticity
KW - glass transition temperature
KW - nanocomposites
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U2 - 10.1002/tee.23264
DO - 10.1002/tee.23264
M3 - Article
AN - SCOPUS:85097021711
SN - 1931-4973
VL - 16
SP - 15
EP - 20
JO - IEEJ Transactions on Electrical and Electronic Engineering
JF - IEEJ Transactions on Electrical and Electronic Engineering
IS - 1
ER -