TY - GEN
T1 - Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for 3D integration
AU - Ohyama, Masaki
AU - Mizuno, Jun
AU - Shoji, Shuichi
AU - Nimura, Masatsugu
AU - Nonaka, Toshihisa
AU - Shinba, Yoichi
AU - Shigetou, Akitsu
PY - 2014/1/1
Y1 - 2014/1/1
N2 - In this study, we developed 8 μm-pitch microbump bonding and encapsulating by hybrid Cu/Sn-adhesive bonding technology. As an adhesive material, we used a non-conductive film (NCF). To realize simultaneous bonding of a metal and an adhesive, planar structure was formed by chemical mechanical polishing (CMP). After the planarization, hybrid bonding was carried out at 250 °C for 60 s. From scanning electron microscopic (SEM) observation of the bonded sample, it was confirmed that 8 μm-pitch bump bonding and the NCF filling 2.5-μm gap between the chip and substrate were performed at the same time. This result indicated that hybrid bonding was effective in fine-pitch bonding and encapsulating for future three-dimensional (3D) integration.
AB - In this study, we developed 8 μm-pitch microbump bonding and encapsulating by hybrid Cu/Sn-adhesive bonding technology. As an adhesive material, we used a non-conductive film (NCF). To realize simultaneous bonding of a metal and an adhesive, planar structure was formed by chemical mechanical polishing (CMP). After the planarization, hybrid bonding was carried out at 250 °C for 60 s. From scanning electron microscopic (SEM) observation of the bonded sample, it was confirmed that 8 μm-pitch bump bonding and the NCF filling 2.5-μm gap between the chip and substrate were performed at the same time. This result indicated that hybrid bonding was effective in fine-pitch bonding and encapsulating for future three-dimensional (3D) integration.
UR - http://www.scopus.com/inward/record.url?scp=84906985474&partnerID=8YFLogxK
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U2 - 10.1109/LTB-3D.2014.6886187
DO - 10.1109/LTB-3D.2014.6886187
M3 - Conference contribution
AN - SCOPUS:84906985474
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -