Formula-based method for capacitance extraction of interconnects with dummy fills

Atsushi Kurokawa*, Akira Kasebe, Toshiki Kanamoto, Yun Yang, Zhangcai Huang, Yasuaki Inoue, Hiroo Masuda

*この研究の対応する著者

    研究成果: Article査読

    1 被引用数 (Scopus)

    抄録

    In advanced ASIC/SoC physical designs, interconnect parasitic extraction is one of the important factors to determine the accuracy of timing analysis. We present a formula-based method to efficiently extract interconnect capacitances of interconnects with dummy fills for VLSI designs. The whole flow is as follows: 1) in each process, obtain capacitances per unit length using a 3-D field solver and then create formulas, and 2) in the actual design phase, execute a well-known 2.5-D capacitance extraction. Our results indicated that accuracies of the proposed formulas were almost within 3% error. The proposed formula-based method can extract interconnect capacitances with high accuracy for VLSI circuits. Moreover, we present formulas to evaluate the effect of dummy fills on interconnect capacitances. These can be useful for determining design guidelines, such as metal density before the actual design, and for analyzing the effect of each structural parameter during the design phase.

    本文言語English
    ページ(範囲)847-855
    ページ数9
    ジャーナルIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
    E89-A
    4
    DOI
    出版ステータスPublished - 2006 4月

    ASJC Scopus subject areas

    • 電子工学および電気工学
    • ハードウェアとアーキテクチャ
    • 情報システム

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