TY - JOUR
T1 - Formula-based method for capacitance extraction of interconnects with dummy fills
AU - Kurokawa, Atsushi
AU - Kasebe, Akira
AU - Kanamoto, Toshiki
AU - Yang, Yun
AU - Huang, Zhangcai
AU - Inoue, Yasuaki
AU - Masuda, Hiroo
PY - 2006/4
Y1 - 2006/4
N2 - In advanced ASIC/SoC physical designs, interconnect parasitic extraction is one of the important factors to determine the accuracy of timing analysis. We present a formula-based method to efficiently extract interconnect capacitances of interconnects with dummy fills for VLSI designs. The whole flow is as follows: 1) in each process, obtain capacitances per unit length using a 3-D field solver and then create formulas, and 2) in the actual design phase, execute a well-known 2.5-D capacitance extraction. Our results indicated that accuracies of the proposed formulas were almost within 3% error. The proposed formula-based method can extract interconnect capacitances with high accuracy for VLSI circuits. Moreover, we present formulas to evaluate the effect of dummy fills on interconnect capacitances. These can be useful for determining design guidelines, such as metal density before the actual design, and for analyzing the effect of each structural parameter during the design phase.
AB - In advanced ASIC/SoC physical designs, interconnect parasitic extraction is one of the important factors to determine the accuracy of timing analysis. We present a formula-based method to efficiently extract interconnect capacitances of interconnects with dummy fills for VLSI designs. The whole flow is as follows: 1) in each process, obtain capacitances per unit length using a 3-D field solver and then create formulas, and 2) in the actual design phase, execute a well-known 2.5-D capacitance extraction. Our results indicated that accuracies of the proposed formulas were almost within 3% error. The proposed formula-based method can extract interconnect capacitances with high accuracy for VLSI circuits. Moreover, we present formulas to evaluate the effect of dummy fills on interconnect capacitances. These can be useful for determining design guidelines, such as metal density before the actual design, and for analyzing the effect of each structural parameter during the design phase.
KW - Capacitance extraction
KW - Capacitance formula
KW - Dummy fill
KW - Interconnect
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U2 - 10.1093/ietfec/e89-a.4.847
DO - 10.1093/ietfec/e89-a.4.847
M3 - Article
AN - SCOPUS:33646263101
SN - 0916-8508
VL - E89-A
SP - 847
EP - 855
JO - IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
JF - IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
IS - 4
ER -