TY - GEN
T1 - Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip
AU - Jiang, Xin
AU - Lei, Xiangyang
AU - Zeng, Lian
AU - Watanabe, Takahiro
N1 - Funding Information:
This paper is a part of the outcome of research performed under a Waseda University Grant for Special Research Projects (Project number: 20l5S-112).
PY - 2016
Y1 - 2016
N2 - Thermal problem is an essential issue which must be taken Into account in the 3D Network-on-Chip NoC) design, because it has a great impact on not only the network performance, but also the reliability of the message transmission. Tn this work, we prescnt a fully adaptive runtime thermal-aware routing algorithm, which combines the distance, traffic state, path dhersity and the thermal impact in the path determination. By simultaneously considering all these factors, the routing algorithm can effectively balance the traffic load while keeping high adaptivity and routability, which also results in an even distribution of temperature across the network. Instead of collecting the topology information of the whole network, we utilize a 12 bits register to reserve the router state for one hop away, which saves the hardware cost largely and decreases the network latency. The simulation results show our proposed routing algorithm can improve the latency and energy consumption by comparing with other previously proposed thermal-aware routing schemes, and the improvement is more remarkable in large scale networks.
AB - Thermal problem is an essential issue which must be taken Into account in the 3D Network-on-Chip NoC) design, because it has a great impact on not only the network performance, but also the reliability of the message transmission. Tn this work, we prescnt a fully adaptive runtime thermal-aware routing algorithm, which combines the distance, traffic state, path dhersity and the thermal impact in the path determination. By simultaneously considering all these factors, the routing algorithm can effectively balance the traffic load while keeping high adaptivity and routability, which also results in an even distribution of temperature across the network. Instead of collecting the topology information of the whole network, we utilize a 12 bits register to reserve the router state for one hop away, which saves the hardware cost largely and decreases the network latency. The simulation results show our proposed routing algorithm can improve the latency and energy consumption by comparing with other previously proposed thermal-aware routing schemes, and the improvement is more remarkable in large scale networks.
KW - 3D NoC
KW - Fully adaptive
KW - Routing algorithm
KW - Thermal-aware
KW - Visual-servoing
UR - http://www.scopus.com/inward/record.url?scp=84978646209&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84978646209&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84978646209
T3 - Lecture Notes in Engineering and Computer Science
SP - 659
EP - 664
BT - IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016
A2 - Feng, David Dagan
A2 - Korsunsky, Alexander M.
A2 - Ao, S. I.
A2 - Douglas, Craig
A2 - Castillo, Oscar
PB - Newswood Limited
T2 - International Multiconference of Engineers and Computer Scientists 2016, IMECS 2016
Y2 - 16 March 2016 through 18 March 2016
ER -