High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin
Takumi Kamibayashi*, Hiroyuki Kuwae, Takahiro Kishioka, Yuki Usui, Takuya Ohashi, Mamoru Tamura, Shuichi Shoji, Jun Mizuno
*この研究の対応する著者
研究成果: Conference contribution
2
被引用数
(Scopus)