TY - GEN
T1 - High Performance Flexible Thermoelectric Device Included Rigid Material
AU - Kashiwagi, Makoto
AU - Koshi, Tomoya
AU - Iwase, Eiji
N1 - Funding Information:
This research was partially supported by JST CREST “Scientific Innovation for Energy Harvesting Technology” (Grant No. JPMJCR16Q5)..
Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - A Thermoelectric device (TE-device) is promising way to achieve energy harvesting from wasted heat. For energy harvesting, flexibility and stretchability are necessary since a heat source surface has complex shape such as free-form surface. We realized high performance flexible TE-device which combining rigid BiTe-based thermoelectric elements (TE-elements) and flexible structures such as stretchable substrate and expandable electrical wirings. In this device, the BiTe-based TE-elements ensures thermoelectric performance and the flexible structures ensures flexibility. By designing as that, the device has high thermoelectric conversion performance which is comparable with conventional TE-device while having flexibility.
AB - A Thermoelectric device (TE-device) is promising way to achieve energy harvesting from wasted heat. For energy harvesting, flexibility and stretchability are necessary since a heat source surface has complex shape such as free-form surface. We realized high performance flexible TE-device which combining rigid BiTe-based thermoelectric elements (TE-elements) and flexible structures such as stretchable substrate and expandable electrical wirings. In this device, the BiTe-based TE-elements ensures thermoelectric performance and the flexible structures ensures flexibility. By designing as that, the device has high thermoelectric conversion performance which is comparable with conventional TE-device while having flexibility.
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U2 - 10.1109/MEMSYS.2019.8870805
DO - 10.1109/MEMSYS.2019.8870805
M3 - Conference contribution
AN - SCOPUS:85074370953
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1010
EP - 1012
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -