High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electroplating

Engineering & Materials Science

• Electric potential 8%
• Electric properties 17%
• Electroplating 98%
• Hybrid vehicles 17%
• Mechanical properties 10%
• Nickel 15%
• Packaging 72%
• Plating 18%
• Power control 14%
• Silicon 12%
• Soldering alloys 15%
• Temperature 32%
• Wire 12%

Physics & Astronomy

• electrical properties 11%
• electroplating 97%
• evaluation 10%
• high voltages 14%
• mechanical properties 10%
• nickel 13%
• packaging 84%
• plating 17%
• power loss 19%
• silicon 8%
• solders 18%
• vehicles 16%
• wire 12%

Chemical Compounds

• Electrical Property 67%
• Electrodeposition 67%
• Solder 100%
• Voltage 58%