@inproceedings{9738188c052c4ab89d9ec2fe10a54e5b,
title = "High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding",
abstract = "New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in order to maximize the performance of SiC power device. Aiming for application to the inverter system of HEV and EV, we have developed a new micro-plating interconnection technology named Nickel Micro Plating Bonding (NMPB), which enables the interconnection in a narrow space between electrodes and SiC devices via our newly designed lead frame, whose lead surface is formed into chevron shape. As for the bonding strength of NMPB, it was confirmed by shear tests that the bonds showed higher bonding strength than ordinary Pb free solder die bonding and no degradation even after HTS at 250°C for 1000hrs and after 1000cycle TCT(250°C/-45°C). The NMPB was applied to the manufacture of one leg SiC inverter power module using two pairs of SiC MOS-FETs and SBDs, which were interconnected with a newly designed lead frame for double sided cooling structure. After molding resin copper heat spreaders were formed on the outer surfaces of both sides of the NMPB leads by additive method. The module showed stable I-V characteristics at 250°C and lower switching loss. The reliability of the modules was confirmed by TCTs and power cycle tests.",
keywords = "Cu lead, EV, Inverter, MOS-FET, Micro-plating, NMPB, Ni, Power module, SBD, Silicon carbide",
author = "Kohei Tatsumi and Isamu Morisako and Keiko Wada and Minoru Fukuomori and Tomonori Iizuka and Nobuaki Sato and Koji Shimizu and Kazutoshi Ueda and Masayuki Hikita and Rikiya Kamimura and Naoki Kawanabe and Kazuhiko Sugiura and Kazuhiro Tsuruta and Keiji Toda",
note = "Funding Information: This work was supported by the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), and “Next-generation power electronics/ Research and development of packaging technology for high temperature resistant SiC module of automobile of next-generation SiC power electronics” (funding agency: NEDO) Publisher Copyright: {\textcopyright} 2019 IEEE.; 69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",
year = "2019",
month = may,
doi = "10.1109/ECTC.2019.00223",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1451--1456",
booktitle = "Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019",
}