TY - JOUR
T1 - High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength
AU - Tanaka, Toshikatsu
AU - Wang, Zengbin
AU - Iizuka, Tomonori
AU - Kozako, Masahiro
AU - Ohki, Yoshimichi
PY - 2011/12/1
Y1 - 2011/12/1
N2 - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
AB - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
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U2 - 10.1109/CEIDP.2011.6232750
DO - 10.1109/CEIDP.2011.6232750
M3 - Conference article
AN - SCOPUS:84864694945
SN - 0084-9162
SP - 691
EP - 694
JO - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
JF - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
M1 - 6232750
T2 - 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011
Y2 - 16 October 2011 through 19 October 2011
ER -