Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
|ジャーナル||Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP|
|出版ステータス||Published - 2011 12月 1|
|イベント||2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico|
継続期間: 2011 10月 16 → 2011 10月 19
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