TY - GEN
T1 - Highly linear high isolation SPDT switch IC with back-gate effect and floating body technique in 180-nm CMOS
AU - Xu, Xiao
AU - Yang, Xin
AU - Sun, Zheng
AU - Kurniawan, Taufiq Alif
AU - Yoshimasu, Toshihiko
N1 - Funding Information:
ACKNOWLEDGMENT This work is supported by VDEC, University of Tokyo in collaboration with Cadence Design Systems inc, Mentor Graphics inc, and Agilent Technologies Japan Ltd.
Publisher Copyright:
© 2015 IEEE.
PY - 2016/1/8
Y1 - 2016/1/8
N2 - This paper presents a broadband single-pole double-throw (SPDT) switch IC in a 180-nm CMOS process. Back-gate voltage injection and floating body technique are utilized to improve the power handling capability, insertion loss and isolation performance, simultaneously. The fabricated SPDT switch IC has exhibited an input referred 0.3-dB compression point of 21.0 dBm, an isolation of 42.7 dB and an insertion loss of 1.1 dB for transmit mode at an operation frequency of 5.0 GHz.
AB - This paper presents a broadband single-pole double-throw (SPDT) switch IC in a 180-nm CMOS process. Back-gate voltage injection and floating body technique are utilized to improve the power handling capability, insertion loss and isolation performance, simultaneously. The fabricated SPDT switch IC has exhibited an input referred 0.3-dB compression point of 21.0 dBm, an isolation of 42.7 dB and an insertion loss of 1.1 dB for transmit mode at an operation frequency of 5.0 GHz.
KW - Back-gate effect
KW - Broadband
KW - Floating body technique
KW - High isolation
KW - High power handling capability
KW - SPDT switch IC
UR - http://www.scopus.com/inward/record.url?scp=84963532394&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963532394&partnerID=8YFLogxK
U2 - 10.1109/RFIT.2015.7377902
DO - 10.1109/RFIT.2015.7377902
M3 - Conference contribution
AN - SCOPUS:84963532394
T3 - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
SP - 106
EP - 108
BT - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
Y2 - 26 August 2015 through 28 August 2015
ER -