TY - GEN
T1 - Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration
AU - Nimura, Masatsugu
AU - Mizuno, Jun
AU - Shigetou, Akitsu
AU - Sakuma, Katsuyuki
AU - Ogino, Hiroshi
AU - Enomoto, Tomoyuki
AU - Shoji, Shuichi
PY - 2013/9/9
Y1 - 2013/9/9
N2 - This paper describes the hybrid Au-Au bonding technology in which the Au-Au and adhesive-adhesive bonding are carried out simultaneously using planar adhesive structure for 3D integration. The planar adhesive structure was fabricated by CMP of adhesive, and consists of ultralow-profiled Au bump with flat surface and uncured adhesive. The bonded interface was observed with SAM and SEM. The results indicate that Au bump connection and the adhesive filling of the 6-μm gap between bonded chip and substrate were achieved without significant void. All 900 bumps were also electrically connected. Furthermore, the shear strength of the bonded sample was13 MPa. The adhesive was strongly bonded because the Si substrate of bonded sample was broken to pieces.
AB - This paper describes the hybrid Au-Au bonding technology in which the Au-Au and adhesive-adhesive bonding are carried out simultaneously using planar adhesive structure for 3D integration. The planar adhesive structure was fabricated by CMP of adhesive, and consists of ultralow-profiled Au bump with flat surface and uncured adhesive. The bonded interface was observed with SAM and SEM. The results indicate that Au bump connection and the adhesive filling of the 6-μm gap between bonded chip and substrate were achieved without significant void. All 900 bumps were also electrically connected. Furthermore, the shear strength of the bonded sample was13 MPa. The adhesive was strongly bonded because the Si substrate of bonded sample was broken to pieces.
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U2 - 10.1109/ECTC.2013.6575719
DO - 10.1109/ECTC.2013.6575719
M3 - Conference contribution
AN - SCOPUS:84883317061
SN - 9781479902330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1153
EP - 1157
BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Y2 - 28 May 2013 through 31 May 2013
ER -