Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Mamoru Tamura, Tomoyuki Enomoto, Akitsu Shigetou
研究成果: Conference contribution
11
被引用数
(Scopus)