Impacts of temperature and moisture on the resistive switching characteristics of a Cu-Ta₂O₅-based atomic switch

Engineering & Materials Science

• Hydrogen bonds 85%
• Moisture 80%
• Oxides 80%
• Switches 67%
• Grain boundaries 62%
• Metal ions 44%
• Temperature 37%
• Nucleation 32%
• Electric potential 16%

Physics & Astronomy

• moisture 100%
• switches 76%
• hydrogen bonds 64%
• oxides 58%
• grain boundaries 46%
• metal ions 33%
• temperature 27%
• nucleation 23%
• electric potential 16%

Chemical Compounds

• Grain Boundary 96%
• Hydrogen Bond 56%
• Oxide 50%
• Nucleation 38%
• Voltage 33%
• Strength 29%
• Metal Ion 29%