Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration

Akiko Okada; Masatsugu Nimura; Naoko Unami; Akitsu Shigetou; Hirokazu Noma; Katsuyuki Sakuma; Shuichi Shoji; Jun Mizuno

doi:10.1109/LTB-3D.2012.6238082

Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration

Akiko Okada^*, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Shuichi Shoji, Jun Mizuno

^*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O ₃ treatment can remove organic contaminants without damages. The Au-Au bonding with VUV/O ₃ treatment was achieved at 200 °C. The average shear strength was about 80 MPa per unit area. Therefore, it was proved that VUV/O ₃ treatment is effective in Au-Au bonding.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
ページ	171
ページ数	1
DOI	https://doi.org/10.1109/LTB-3D.2012.6238082
出版ステータス	Published - 2012
イベント	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan 継続期間: 2012 5月 22 → 2012 5月 23

出版物シリーズ

名前	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
国/地域	Japan
City	Tokyo
Period	12/5/22 → 12/5/23

ASJC Scopus subject areas

コンピュータグラフィックスおよびコンピュータ支援設計
コンピュータビジョンおよびパターン認識

文献へのアクセス

10.1109/LTB-3D.2012.6238082

他のファイルとリンク

引用スタイル

Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Shoji, S., & Mizuno, J. (2012). Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 171). Article 6238082 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238082

Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration. / Okada, Akiko; Nimura, Masatsugu; Unami, Naoko その他.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 171 6238082 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

研究成果: Conference contribution

Okada, A, Nimura, M, Unami, N, Shigetou, A, Noma, H, Sakuma, K, Shoji, S & Mizuno, J 2012, Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238082, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 171, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 12/5/22. https://doi.org/10.1109/LTB-3D.2012.6238082

Okada A, Nimura M, Unami N, Shigetou A, Noma H, Sakuma K その他. Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 171. 6238082. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238082

Okada, Akiko ; Nimura, Masatsugu ; Unami, Naoko その他. / Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 171 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

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