TY - GEN
T1 - Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition
AU - Yamada, Kosuke
AU - Kuwae, Hiroyuki
AU - Kamibayashi, Takumi
AU - Momose, Wataru
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Funding Information:
This work is partly supported by Japan Ministry of Education, Culture, Sport Science & Technology (MEXT) Grant-in-Aid for Scientific Basic Research (A) No. 16H02349 and Young Scientists No. 18K13770. The authors thank for MEXT Nanotechnology Platform Support Project of Waseda University.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.
AB - We propose a low temperature bonding technique using an ultrathin intermediate layer deposited by atomic layer deposition. The ultrathin Pt film is selectively deposited on Cu surfaces without any masks. In order to reduce a deterioration of a reliability caused by impurities in the bonding interface, quasi-direct bonding was realized by thinning Pt intermediate layer. The shear strength of Cu-Cu bonding with the Pt intermediate layer achieved 9.5 MPa, which was five times higher than that without the Pt intermediate layer. We expect that the proposed bonding technique has a high potential to low temperature packaging technologies.
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U2 - 10.1109/IMPACT.2018.8625756
DO - 10.1109/IMPACT.2018.8625756
M3 - Conference contribution
AN - SCOPUS:85062452713
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 123
EP - 126
BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PB - IEEE Computer Society
T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Y2 - 24 October 2018 through 26 October 2018
ER -