Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu; Hiroyuki Kuwae; Bo Ma; Shuichi Shoji; Jun Mizuno

doi:10.23919/ICEP.2017.7939349

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shoji, Jun Mizuno

ナノ・ライフ創新研究機構

研究成果: Conference contribution

抄録

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O₃) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

本文言語	English
ホスト出版物のタイトル	2017 International Conference on Electronics Packaging, ICEP 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	167-170
ページ数	4
ISBN（電子版）	9784990218836
DOI	https://doi.org/10.23919/ICEP.2017.7939349
出版ステータス	Published - 2017 6月 5
イベント	2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan 継続期間: 2017 4月 19 → 2017 4月 22

Other

Other	2017 International Conference on Electronics Packaging, ICEP 2017
国/地域	Japan
City	Tendo, Yamagata
Period	17/4/19 → 17/4/22

ASJC Scopus subject areas

電子工学および電気工学
産業および生産工学
電子材料、光学材料、および磁性材料

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10.23919/ICEP.2017.7939349

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Fu, W, Kuwae, H, Ma, B, Shoji, S & Mizuno, J 2017, Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). in 2017 International Conference on Electronics Packaging, ICEP 2017., 7939349, Institute of Electrical and Electronics Engineers Inc., pp. 167-170, 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 17/4/19. https://doi.org/10.23919/ICEP.2017.7939349

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title = "Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)",

abstract = "Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.",

keywords = "direct bonding, low temperature bonding, polyoxymethylene, self-assembled monolayer, VUV",

author = "Weixin Fu and Hiroyuki Kuwae and Bo Ma and Shuichi Shoji and Jun Mizuno",

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AU - Fu, Weixin

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AU - Ma, Bo

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2017/6/5

Y1 - 2017/6/5

N2 - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

AB - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

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Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

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