TY - GEN
T1 - Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects
AU - Mimatsu, Hayata
AU - Mizuno, Jun
AU - Kasahara, Takashi
AU - Saito, Mikiko
AU - Shoji, Shuichi
AU - Nishikawa, Hiroshi
PY - 2014
Y1 - 2014
N2 - We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.
AB - We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.
UR - http://www.scopus.com/inward/record.url?scp=84899018326&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84899018326&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2014.6765845
DO - 10.1109/MEMSYS.2014.6765845
M3 - Conference contribution
AN - SCOPUS:84899018326
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1131
EP - 1134
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -