TY - GEN
T1 - Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering
AU - Yamamoto, Takehiro
AU - Faiz, M. Khairi
AU - Suga, Tadatomo
AU - Miyashita, Tomoyuki
AU - Yoshida, Makoto
N1 - Funding Information:
This paper is based on results obtained from a project subsidized by the New Energy and Industrial Technology Development Organization (NEDO), Japan. Authors also thank to The Material Characterization Central Laboratory, Waseda University for DSC test.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/26
Y1 - 2017/12/26
N2 - In this work, low temperature of 200°C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150°C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150°C is examined by means of differential scanning calorimetry (DSC). In 70 mass% added Sn-Bi (Cu-70SnBi), which was sintered at 200°C, the remelting event at 139°C occurred due to the residual Sn-Bi eutectic phase and assumed to result in the decrease of shear strength at 150°C. On contrary, in 65 mass% added Sn-Bi (Cu-65SnBi), which was sintered at the same conditions, remelting event at 139°C was not observed, and the obtained shear strength at 150°C was almost similar to that of at room temperature (R. T.).
AB - In this work, low temperature of 200°C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150°C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150°C is examined by means of differential scanning calorimetry (DSC). In 70 mass% added Sn-Bi (Cu-70SnBi), which was sintered at 200°C, the remelting event at 139°C occurred due to the residual Sn-Bi eutectic phase and assumed to result in the decrease of shear strength at 150°C. On contrary, in 65 mass% added Sn-Bi (Cu-65SnBi), which was sintered at the same conditions, remelting event at 139°C was not observed, and the obtained shear strength at 150°C was almost similar to that of at room temperature (R. T.).
KW - Cu nano particle
KW - Sn-Bi
KW - transient liquid phase sintering
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U2 - 10.1109/ICSJ.2017.8240132
DO - 10.1109/ICSJ.2017.8240132
M3 - Conference contribution
AN - SCOPUS:85049251608
T3 - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
SP - 139
EP - 140
BT - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
Y2 - 20 November 2017 through 22 November 2017
ER -