TY - JOUR
T1 - Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer
AU - Fu, Weixin
AU - Ma, Bo
AU - Kuwae, Hiroyuki
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Funding Information:
The authors would like to acknowledge the Ministry of Education, Culture, Sports, Science and Technology, Japan (MEXT) Grant-in-Aid for Scientific Basic Research (A) No. 16H02349 for supporting this work. The authors also wish to acknowledge the support provided by the MEXT Nanotechnology Platform Support Project of Waseda University. W. Fu also acknowledges the Leading Graduate Program in Science and Engineering, Waseda University from MEXT. The authors would also like to thank Professors Kawai and Asakura for providing the materials.
Publisher Copyright:
© 2018 The Japan Society of Applied Physics.
PY - 2018/2
Y1 - 2018/2
N2 - A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.
AB - A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.
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U2 - 10.7567/JJAP.57.02BB01
DO - 10.7567/JJAP.57.02BB01
M3 - Article
AN - SCOPUS:85040942430
SN - 0021-4922
VL - 57
JO - Japanese journal of applied physics
JF - Japanese journal of applied physics
IS - 2
M1 - 02BB01
ER -