With the latest performance enhancement of mobile facilities typically such as notebook size PCs, mobile telephones, etc., down-sizing and performance enhancement of the semiconductor devices for general use have been accelerated, resulting in demands for semiconductor device assembly in increasingly higher densities. In the high density assembly of high performance semiconductor devices, the bonding wire method using lead frames hitherto widely applied is being substituted with the flip chip method wherein a chip is directly connected to a substrate by forming bumps on the chip. This paper introduces a newly developed bump forming method, the micro-ball bumping technology, and describes advantages of the developed method compared with alternative technologies such as plating and printing methods.
|ジャーナル||Nippon Steel Technical Report|
|出版ステータス||Published - 2001 7月 1|
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