Micro-ball bumping technology for flip chip and TAB interconnections

K. Tatsumi*, K. Shimokawa, E. Hashino, Y. Ohzeki, T. Nakamori, M. Tanaka


研究成果: Article査読

8 被引用数 (Scopus)


A new bumping method using micro-balls was developed that can be used for high-density LSI assembly, specifically, for the TAB interconnection and Flip Chip interconnection. Using this method, gold and solder balls with the diameter ranging from 35μm to 150 μm are first formed with a high level of accuracy and sphericity. These balls are then attached to the through-holes of the arrangement plate by vacuum suction so positioned as to match the positions of electrodes where bumps need to be formed, and are aligned and bonded to the electrodes of an LSI chip or substrate. This method has made possible the formation of gold bumps for TAB and Flip Chips and solder bumps for Flip Chip with high efficiency and precision.

ジャーナルInternational Journal of Microcircuits and Electronic Packaging
出版ステータスPublished - 1999 6月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 安全性、リスク、信頼性、品質管理
  • 電子工学および電気工学


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