Morphology and coercivity of FePt thin films sputter deposited on Cu and Ag underlayers

C. You; K. Hono; Y. Takahashi

doi:10.1109/INTMAG.2006.375663

Morphology and coercivity of FePt thin films sputter deposited on Cu and Ag underlayers

C. You^*, K. Hono, Y. Takahashi

^*この研究の対応する著者

研究成果: Conference contribution

本文言語	English
ホスト出版物のタイトル	INTERMAG 2006 - IEEE International Magnetics Conference
ページ	163
ページ数	1
DOI	https://doi.org/10.1109/INTMAG.2006.375663
出版ステータス	Published - 2006
外部発表	はい
イベント	INTERMAG 2006 - IEEE International Magnetics Conference - San Diego, CA, United States 継続期間: 2006 5月 8 → 2006 5月 12

出版物シリーズ

名前	INTERMAG 2006 - IEEE International Magnetics Conference

Conference

Conference	INTERMAG 2006 - IEEE International Magnetics Conference
国/地域	United States
City	San Diego, CA
Period	06/5/8 → 06/5/12

ASJC Scopus subject areas

電子工学および電気工学
電子材料、光学材料、および磁性材料

文献へのアクセス

10.1109/INTMAG.2006.375663

他のファイルとリンク

引用スタイル

You, C, Hono, K & Takahashi, Y 2006, Morphology and coercivity of FePt thin films sputter deposited on Cu and Ag underlayers. in INTERMAG 2006 - IEEE International Magnetics Conference., 4261597, INTERMAG 2006 - IEEE International Magnetics Conference, pp. 163, INTERMAG 2006 - IEEE International Magnetics Conference, San Diego, CA, United States, 06/5/8. https://doi.org/10.1109/INTMAG.2006.375663

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