Multi-Objective Design Optimization of Power Module Performances

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

As next-generation power modules develop with three-dimensional wiring structures and high-speed switching schemes, strategies to reduce the parasitic inductance and temperature will be essential to meet the increasingly demanding workloads. In this study, we developed a multi-objective design optimization system for power modules and rendered Pareto solutions outlining the inductance of the path between the main terminals, the total inductance of the paths between the control terminals, and the surface temperature of the path between the main terminals, being useful to design power modules with utmost thermal and inductance performance.

本文言語English
ホスト出版物のタイトル2022 International Conference on Electronics Packaging, ICEP 2022
出版社Institute of Electrical and Electronics Engineers Inc.
ページ157-158
ページ数2
ISBN(電子版)9784991191138
DOI
出版ステータスPublished - 2022
イベント21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
継続期間: 2022 5月 112022 5月 14

出版物シリーズ

名前2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
国/地域Japan
CitySapporo
Period22/5/1122/5/14

ASJC Scopus subject areas

  • プロセス化学およびプロセス工学
  • 電子工学および電気工学
  • 産業および生産工学
  • 電子材料、光学材料、および磁性材料

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