New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process

Engineering & Materials Science

• Self assembled monolayers 100%
• Plating 71%
• Low-k dielectric 63%
• Diffusion barriers 63%
• Thin films 60%
• Substrates 45%
• ULSI circuits 35%
• Electroless plating 28%
• Thermodynamic stability 22%
• Catalysts 18%
• Hydrogen 17%
• Fabrication 15%

Chemical Compounds

• Self Assembled Monolayer 62%
• Diffusion Barrier 53%
• Silsesquioxane 52%
• Dielectric Material 37%
• Liquid Film 31%
• Thermal Stability 14%
• Diffusion 13%
• Hydrogen 10%
• Catalyst 8%