Newly developed flip-chip bonding technology for high-density interconnects in semiconductor package

Tokihiko Yokoshima^*, Fumito Imura, Masahiro Aoyagi

^*この研究の対応する著者

研究成果: Article › 査読

1 被引用数 (Scopus)

本文言語	English
ページ（範囲）	606-615
ページ数	10
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	12
号	7
DOI	https://doi.org/10.5104/jiep.12.606
出版ステータス	Published - 2009 11月
外部発表	はい

ASJC Scopus subject areas

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