TY - CONF
T1 - Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating
AU - Fu, Weixin
AU - Mizuno, Jun
AU - Shoji, Shuichi
AU - Kasahara, Takashi
AU - Okada, Akiko
AU - Ishizuka, Shugo
PY - 2013/1/1
Y1 - 2013/1/1
N2 - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
AB - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
KW - Ag nanoparticle bump
KW - low temperature bonding
KW - squeegee-coating method
UR - http://www.scopus.com/inward/record.url?scp=84897521692&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84897521692&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2013.6756116
DO - 10.1109/ICSJ.2013.6756116
M3 - Paper
AN - SCOPUS:84897521692
T2 - 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
Y2 - 11 November 2013 through 13 November 2013
ER -