TY - GEN
T1 - Oxidized Silicon Terminated Diamond p-MOSFETs with Channel Mobility >150 cm2V-1s-1 and |VTH|> 3V Normally-off for Complementary Power Circuits
AU - Kawarada, H.
AU - Ota, K.
AU - Fu, Y.
AU - Narita, A.
AU - Zhu, X.
AU - Hiraiwa, A.
AU - Fujishima, T.
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Oxidized silicon terminated (C-Si-O) diamond surface has been applied for lateral and vertical MOSFETs. C-Si-O bonds instead of C-O-Si bonds are key to fabricate higher channel mobility of diamond p channel MOSFETs (p-MOSFETs). The hole channel mobility exceeds 150 cm2V-1s-1 which is higher than the electron mobility of SiC n-MOSFETs. The threshold voltage VTH of diamond p-MOSFET is negatively large enough (VTH < -3V) for normally-off operation at high voltage circuits. Maximum drain current densities ID,Max were >300 mAmm-1 in lateral FETs and >200 mAmm-1 in vertical FETs. They are the highest in normally-off operation of diamond p-FETs.
AB - Oxidized silicon terminated (C-Si-O) diamond surface has been applied for lateral and vertical MOSFETs. C-Si-O bonds instead of C-O-Si bonds are key to fabricate higher channel mobility of diamond p channel MOSFETs (p-MOSFETs). The hole channel mobility exceeds 150 cm2V-1s-1 which is higher than the electron mobility of SiC n-MOSFETs. The threshold voltage VTH of diamond p-MOSFET is negatively large enough (VTH < -3V) for normally-off operation at high voltage circuits. Maximum drain current densities ID,Max were >300 mAmm-1 in lateral FETs and >200 mAmm-1 in vertical FETs. They are the highest in normally-off operation of diamond p-FETs.
UR - http://www.scopus.com/inward/record.url?scp=85185608196&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85185608196&partnerID=8YFLogxK
U2 - 10.1109/IEDM45741.2023.10413761
DO - 10.1109/IEDM45741.2023.10413761
M3 - Conference contribution
AN - SCOPUS:85185608196
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2023 International Electron Devices Meeting, IEDM 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 International Electron Devices Meeting, IEDM 2023
Y2 - 9 December 2023 through 13 December 2023
ER -