TY - GEN
T1 - Post-hydrophilic treatment free plastic biochip fabrication method using polyurea film
AU - Shinohara, H.
AU - Takahashi, Y.
AU - Mizuno, J.
AU - Shoji, S.
PY - 2008
Y1 - 2008
N2 - A novel low temperature bonding method was developed by using polyurea film as intermediate layers. A microchip having microchannel which has highly hydrophilic surface was realized by the pretreatment of VUV (vacuum ultraviolet) light irradiation. The bonding temperature was low enough to use thermo plastic channel plates such as PMMA (poly-methyl methacrylate) with negligible deformation of the channel structure. The results of contact angle measurements indicate that the highly hydrophilic surface of the microchannel was kept after the bonding process. For actual micro biochip fabrication, the post-hydrophilic treatment after bonding process can be skipped.
AB - A novel low temperature bonding method was developed by using polyurea film as intermediate layers. A microchip having microchannel which has highly hydrophilic surface was realized by the pretreatment of VUV (vacuum ultraviolet) light irradiation. The bonding temperature was low enough to use thermo plastic channel plates such as PMMA (poly-methyl methacrylate) with negligible deformation of the channel structure. The results of contact angle measurements indicate that the highly hydrophilic surface of the microchannel was kept after the bonding process. For actual micro biochip fabrication, the post-hydrophilic treatment after bonding process can be skipped.
UR - http://www.scopus.com/inward/record.url?scp=50149103436&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50149103436&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2008.4443669
DO - 10.1109/MEMSYS.2008.4443669
M3 - Conference contribution
AN - SCOPUS:50149103436
SN - 9781424417933
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 367
EP - 370
BT - MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
T2 - 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
Y2 - 13 January 2008 through 17 January 2008
ER -