Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Norihiro Togasaki; Yutaka Okinaka; Takayuki Homma; Tetsuya Osaka

doi:10.1016/j.electacta.2005.04.057

Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

Norihiro Togasaki, Yutaka Okinaka, Takayuki Homma, Tetsuya Osaka^*

^*この研究の対応する著者

研究成果: Article › 査読

34 被引用数 (Scopus)

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A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

本文言語	English
ページ（範囲）	882-887
ページ数	6
ジャーナル	Electrochimica Acta
巻	51
号	5
DOI	https://doi.org/10.1016/j.electacta.2005.04.057
出版ステータス	Published - 2005 11月 10

ASJC Scopus subject areas

化学工学（全般）
電気化学

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10.1016/j.electacta.2005.04.057

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abstract = "A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.",

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T1 - Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

AU - Togasaki, Norihiro

AU - Okinaka, Yutaka

AU - Homma, Takayuki

AU - Osaka, Tetsuya

PY - 2005/11/10

Y1 - 2005/11/10

N2 - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

AB - A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.

KW - Amorphous gold-nickel alloy

KW - Contact resistance

KW - Hardness

KW - Nickel-tungsten alloy

KW - Resistivity

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JO - Electrochimica Acta

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Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

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