抄録
Cu‐metal‐doped glass films having a Cu:Si atomic ratio of 0.05 ± 0.002 were successfully prepared by a sol‐gel method using a dipping technique. The appearance of surface plasmon of Cu metal at about 570 nm was observed after heat treatment at or above 700°C. The third‐order nonlinear susceptibility (x3) was as high as 5.0 × 10–8 esu at 570 nm.
本文言語 | English |
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ページ(範囲) | 1110-1112 |
ページ数 | 3 |
ジャーナル | Journal of the American Ceramic Society |
巻 | 77 |
号 | 4 |
DOI | |
出版ステータス | Published - 1994 |
外部発表 | はい |
ASJC Scopus subject areas
- セラミックおよび複合材料
- 材料化学