抄録
Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin content in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 1471-1476 |
| ページ数 | 6 |
| ジャーナル | Journal of the Electrochemical Society |
| 巻 | 141 |
| 号 | 6 |
| DOI | |
| 出版ステータス | Published - 1994 6月 |
| 外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 凝縮系物理学
- 材料化学
- 表面、皮膜および薄膜
- 電気化学
- 再生可能エネルギー、持続可能性、環境