抄録
A simplified isolation process for test CMOS LSI chip fabrication is proposed. In the process, channel-stop implantation is self-aligned to the p-well and the p-well active area. It is shown that a CMOS device with a one-level metallization can be fabricated with only seven photomasks using the process.
本文言語 | English |
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ジャーナル | IEEE Transactions on Electron Devices |
巻 | ED-34 |
号 | 12 |
出版ステータス | Published - 1987 12月 1 |
外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学