抄録
The aim of this study is to measure the cure shrinkage of epoxy resin system used in the CFRP. First, the cure kinetics of Bisphenol A type epoxy resin system was studied by Differential Scanning Calorimetry measurement. From the dynamic DSC measurement, the total heat of cure of the epoxy was determined as 293 [kJ/g]. Also, curing condition and the extent of cure were determined by the isothermal DSC and TGA measurement. By controlling the curing condition, immature cured epoxy bar-shaped specimen was moulded. The cure shrinkage was measured by using the laser confocal displacement meter without any contact with the bar-shaped specimen. Comparing the specimen size after each cure, cure shrinkage of the bar-shaped specimen was measured.
| 本文言語 | English |
|---|---|
| ホスト出版物のタイトル | ICCM International Conferences on Composite Materials |
| 出版ステータス | Published - 2007 |
| イベント | 16th International Conference on Composite Materials, ICCM-16 - "A Giant Step Towards Environmental Awareness: From Green Composites to Aerospace" - Kyoto 継続期間: 2007 7月 8 → 2007 7月 13 |
Other
| Other | 16th International Conference on Composite Materials, ICCM-16 - "A Giant Step Towards Environmental Awareness: From Green Composites to Aerospace" |
|---|---|
| City | Kyoto |
| Period | 07/7/8 → 07/7/13 |
ASJC Scopus subject areas
- 工学（全般）
- セラミックおよび複合材料