The heat diffusion model of IC chip is equivalent to electrical resistors and capacitors (RC) network. Instead of using direct methods to solve the network equations, a novel statistical method based on random walk techniques was proposed for thermal RC network analysis in this paper. The corresponding 2 dimension temperature distribution was derived finally. Experimental results show the simulation results are accurate enough to satisfy the error margin and the proposed method is much faster than the general method for large scale network analysis.
|ホスト出版物のタイトル||ASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC|
|出版ステータス||Published - 2009|
|イベント||2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha|
継続期間: 2009 10月 20 → 2009 10月 23
|Other||2009 8th IEEE International Conference on ASIC, ASICON 2009|
|Period||09/10/20 → 09/10/23|
ASJC Scopus subject areas