TY - GEN
T1 - Relation between the Glass Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins
AU - Mori, Keigo
AU - Hirai, Naoshi
AU - Ohki, Yoshimichi
AU - Otake, Yasutomo
AU - Umemoto, Takahiro
AU - Muto, Hirotaka
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - Bisphenol A and F epoxy resins, EA and EF for short respectively, are used widely for insulation in power apparatus. In this paper, we compare the superiority in dielectric property between EA and EF. For EA and EF cured at two different conditions, the glass transition temperature (Tg), complex relative permittivity (ϵr' - jϵr), conductivity (σ), thermally stimulated depolarization current (TSDC), and bending elastic modulus were measured. As a result, EF has a lower Tg than EA. Regarding this, in EF, ϵr', ϵr, and σ rapidly increase when the temperature exceeds 140 °C and the difference in dielectric property between EA and EF becomes significant in this temperature range.
AB - Bisphenol A and F epoxy resins, EA and EF for short respectively, are used widely for insulation in power apparatus. In this paper, we compare the superiority in dielectric property between EA and EF. For EA and EF cured at two different conditions, the glass transition temperature (Tg), complex relative permittivity (ϵr' - jϵr), conductivity (σ), thermally stimulated depolarization current (TSDC), and bending elastic modulus were measured. As a result, EF has a lower Tg than EA. Regarding this, in EF, ϵr', ϵr, and σ rapidly increase when the temperature exceeds 140 °C and the difference in dielectric property between EA and EF becomes significant in this temperature range.
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U2 - 10.1109/CEIDP47102.2019.9010555
DO - 10.1109/CEIDP47102.2019.9010555
M3 - Conference contribution
AN - SCOPUS:85081680674
T3 - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
SP - 426
EP - 429
BT - 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
Y2 - 20 October 2019 through 23 October 2019
ER -