TY - JOUR
T1 - Resistive Switching Memristor
T2 - On the Direct Observation of Physical Nature of Parameter Variability
AU - Wang, Zheng
AU - Xiao, Wei
AU - Yang, Huiyong
AU - Zhang, Shengjie
AU - Zhang, Yukun
AU - Sun, Kai
AU - Wang, Ting
AU - Fu, Yujun
AU - Wang, Qi
AU - Zhang, Junyan
AU - Hasegawa, Tsuyoshi
AU - He, Deyan
N1 - Funding Information:
Part of the project was financially supported by the National Natural Science Foundation of China (Grant No. 61874051, U1732136, and 61404064) and the Key Program of Natural Science Foundation of Gansu Province (Grant No. 20JR5RA296). Part of the project was supported by Supercomputing Center of Lanzhou University.
Publisher Copyright:
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PY - 2022/1/12
Y1 - 2022/1/12
N2 - Ion-based memristive switching has attracted widespread attention from industries owing to its outstanding advantages in storage and neuromorphic computing. Major issues for achieving brain-inspired computation of highly functional memory in redox-based ion devices are relatively large variability in their operating parameters and limited cycling endurance. In some devices, volatile and nonvolatile operations often replace each other without changing operating conditions. To address these issues, it is important to observe directly what is happening in repeated operations. Herein, we use a planar device that enables direct capturing of microscopic behaviors in the nucleation and growth of metal whiskers under repeated switching to verify the microscopic origin of the large parameter variability. We report direct observations that reveal the physical origin for the large cycle-to-cycle and device-to-device variability in memristive switching, which was achieved using planar polymer atomic switches with a gap >1 μm. We find that the deposition location of metal atoms is closely related to the crystallinity of the ion transport layer (solid polymer electrolyte, SPE). The filament variability (shape, position, quantity, etc.) during different cycles and devices is indeed the main reason for the observed variability in the operating characteristics. The results shed unique light on the complexity of the operation of the ion device, that is, the evolution of the dielectric layer and metal filament must be considered.
AB - Ion-based memristive switching has attracted widespread attention from industries owing to its outstanding advantages in storage and neuromorphic computing. Major issues for achieving brain-inspired computation of highly functional memory in redox-based ion devices are relatively large variability in their operating parameters and limited cycling endurance. In some devices, volatile and nonvolatile operations often replace each other without changing operating conditions. To address these issues, it is important to observe directly what is happening in repeated operations. Herein, we use a planar device that enables direct capturing of microscopic behaviors in the nucleation and growth of metal whiskers under repeated switching to verify the microscopic origin of the large parameter variability. We report direct observations that reveal the physical origin for the large cycle-to-cycle and device-to-device variability in memristive switching, which was achieved using planar polymer atomic switches with a gap >1 μm. We find that the deposition location of metal atoms is closely related to the crystallinity of the ion transport layer (solid polymer electrolyte, SPE). The filament variability (shape, position, quantity, etc.) during different cycles and devices is indeed the main reason for the observed variability in the operating characteristics. The results shed unique light on the complexity of the operation of the ion device, that is, the evolution of the dielectric layer and metal filament must be considered.
KW - in situ XRD
KW - ionics
KW - memristor
KW - resistive switching
KW - solid polymer electrolyte
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U2 - 10.1021/acsami.1c19364
DO - 10.1021/acsami.1c19364
M3 - Article
C2 - 34957821
AN - SCOPUS:85122293033
SN - 1944-8244
VL - 14
SP - 1557
EP - 1567
JO - ACS applied materials & interfaces
JF - ACS applied materials & interfaces
IS - 1
ER -