TY - GEN
T1 - Self-Healing Metal Interconnect for Flexible Electronic Device
AU - Koshi, Tomoya
AU - Iwase, Eiji
PY - 2019/4
Y1 - 2019/4
N2 - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.
AB - We developed a self-healing metal interconnect and applied it to a flexible electronic device. The self-healing metal interconnect regains its conductivity again even if the interconnect is broken by stretching deformation. For the selfhealing, dielectrophoresis of metal nanoparticles is used. In this paper, design, fabrication, and evaluation of a flexible electronic device using self-healing metal interconnects are described. The device was composed of self-healing metal interconnects and surface-mounted light emitting diode (LED) chips. We confirmed a decrease of impedance of the device and re-emitting of LED chips by self-healing of the broken interconnect.
KW - dielectrophoresis
KW - flexible electronic device
KW - metal nanoparticle
KW - self-healing
UR - http://www.scopus.com/inward/record.url?scp=85068308798&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068308798&partnerID=8YFLogxK
U2 - 10.23919/ICEP.2019.8733474
DO - 10.23919/ICEP.2019.8733474
M3 - Conference contribution
AN - SCOPUS:85068308798
T3 - 2019 International Conference on Electronics Packaging, ICEP 2019
SP - 291
EP - 293
BT - 2019 International Conference on Electronics Packaging, ICEP 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Conference on Electronics Packaging, ICEP 2019
Y2 - 17 April 2019 through 20 April 2019
ER -