TY - GEN
T1 - Self-rolling up micro assembly using temperature - Responsive hydrogel sheet with rigid plate array
AU - Iwata, Yoshitaka
AU - Miyashita, Shuhei
AU - Iwase, Eiji
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - We propose a design method of a micro self-rolling up structure using a temperature-responsive hydrogel sheet with rigid plate array. Our self-rolling up is a method for developing a micro three-dimensional (3D) structure performed by rolling up a two-dimensional (2D) flat sheet, like making a croissant, through a continuous self-folding. The local curvature of the self-rolled up structure could be controlled by the length of rigid plates. By controlling the local curvature, we designed and developed self-rolled up structures with or without gaps between the self-rolled up layers, such as cylindrical and croissant-like ellipsoidal structures. In addition, all the structures demonstrated repetitive deformation of forward and backward rolling up by changing a temperature of water.
AB - We propose a design method of a micro self-rolling up structure using a temperature-responsive hydrogel sheet with rigid plate array. Our self-rolling up is a method for developing a micro three-dimensional (3D) structure performed by rolling up a two-dimensional (2D) flat sheet, like making a croissant, through a continuous self-folding. The local curvature of the self-rolled up structure could be controlled by the length of rigid plates. By controlling the local curvature, we designed and developed self-rolled up structures with or without gaps between the self-rolled up layers, such as cylindrical and croissant-like ellipsoidal structures. In addition, all the structures demonstrated repetitive deformation of forward and backward rolling up by changing a temperature of water.
UR - http://www.scopus.com/inward/record.url?scp=85047011501&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85047011501&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2018.8346491
DO - 10.1109/MEMSYS.2018.8346491
M3 - Conference contribution
AN - SCOPUS:85047011501
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 93
EP - 96
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -