抄録
This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts up a hinged structure due to the shape magnetic anisotropy. Micro flap structures (4.5 μm-thick electroplated Permalloy) having 0.2 μm-thick nickel elastic hinges with various lengths and widths are bent in out-of-plane direction in a magnetic field up to 50 kA/m. The volume of magnetic material and the stiffness of the hinges determine the sensitivity to a magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. By way of the example, we have erected plates 600 μm × 600 μm in size. Also, structures bent at 90 and 45 degrees out of the plane have been obtained at the same time.
| 本文言語 | English |
|---|---|
| ページ | 188-191 |
| ページ数 | 4 |
| 出版ステータス | Published - 2002 1月 1 |
| 外部発表 | はい |
| イベント | 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States 継続期間: 2002 1月 20 → 2002 1月 24 |
Conference
| Conference | 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 |
|---|---|
| 国/地域 | United States |
| City | Las Vegas, NV |
| Period | 02/1/20 → 02/1/24 |
ASJC Scopus subject areas
- 制御およびシステム工学
- 機械工学
- 電子工学および電気工学