TY - GEN
T1 - Simple and high-throughput fabrication of large-area and multilayer flexible polymer film structures for microfluidic organic light emitting diode
AU - Tsuwaki, M.
AU - Mizuno, J.
AU - Kasahara, T.
AU - Edura, T.
AU - Matsunami, S.
AU - Oshima, J.
AU - Adach, C.
AU - Shoji, S.
PY - 2013/4/2
Y1 - 2013/4/2
N2 - A simple and high-throughput fabrication of large-area and multilayer polymer film structures was developed and applied for microfluidic organic light emitting diodes (OLED). We employed following three distinguished technologies, a) screen-printing technique for transparent electrodes, b) novel belt-transfer exposure technology for SU-8 microchannels, and c) heterogeneous low temperature bonding technology using self-assembly monolayer. A Liquid organic semiconductor as a liquid emitter was injected to each microchannel and photoluminescence and electroluminescence were obtained not only in a straight state, but also in a bending state. This large-area flexible microfluidic structure for OLED is applicable to nondisposable posters or displays which can be adopted around the curved surfaces of the various structures.
AB - A simple and high-throughput fabrication of large-area and multilayer polymer film structures was developed and applied for microfluidic organic light emitting diodes (OLED). We employed following three distinguished technologies, a) screen-printing technique for transparent electrodes, b) novel belt-transfer exposure technology for SU-8 microchannels, and c) heterogeneous low temperature bonding technology using self-assembly monolayer. A Liquid organic semiconductor as a liquid emitter was injected to each microchannel and photoluminescence and electroluminescence were obtained not only in a straight state, but also in a bending state. This large-area flexible microfluidic structure for OLED is applicable to nondisposable posters or displays which can be adopted around the curved surfaces of the various structures.
UR - http://www.scopus.com/inward/record.url?scp=84875464230&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84875464230&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2013.6474238
DO - 10.1109/MEMSYS.2013.6474238
M3 - Conference contribution
AN - SCOPUS:84875464230
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 303
EP - 306
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -