TY - GEN
T1 - Soft error tolerant latch designs with low power consumption (invited paper)
AU - Tajima, Saki
AU - Togawa, Nozomu
AU - Yanagisawa, Masao
AU - Shi, Youhua
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/1
Y1 - 2017/7/1
N2 - As semiconductor technology continues scaling down, the reliability issue has become much more critical than ever before. Unlike traditional hard-errors caused by permanent physical damage which can't be recovered in field, soft errors are caused by radiation or voltage/current fluctuations that lead to transient changes on internal node states, thus they can be viewed as temporary errors. However, due to the unpredictable occurrence of soft errors, it is desirable to develop soft error tolerant designs. For this reason, soft error tolerant design techniques have gained great research interest. In this paper, we will explain the soft error mechanism and then review the existing soft error tolerant design techniques with particular emphasis on SEH family because they can achieve low power consumption and small performance overhead as well.
AB - As semiconductor technology continues scaling down, the reliability issue has become much more critical than ever before. Unlike traditional hard-errors caused by permanent physical damage which can't be recovered in field, soft errors are caused by radiation or voltage/current fluctuations that lead to transient changes on internal node states, thus they can be viewed as temporary errors. However, due to the unpredictable occurrence of soft errors, it is desirable to develop soft error tolerant designs. For this reason, soft error tolerant design techniques have gained great research interest. In this paper, we will explain the soft error mechanism and then review the existing soft error tolerant design techniques with particular emphasis on SEH family because they can achieve low power consumption and small performance overhead as well.
UR - http://www.scopus.com/inward/record.url?scp=85044790220&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85044790220&partnerID=8YFLogxK
U2 - 10.1109/ASICON.2017.8252409
DO - 10.1109/ASICON.2017.8252409
M3 - Conference contribution
AN - SCOPUS:85044790220
T3 - Proceedings of International Conference on ASIC
SP - 52
EP - 55
BT - Proceedings - 2017 IEEE 12th International Conference on ASIC, ASICON 2017
A2 - Qin, Yajie
A2 - Hong, Zhiliang
A2 - Tang, Ting-Ao
PB - IEEE Computer Society
T2 - 12th IEEE International Conference on Advanced Semiconductor Integrated Circuits, ASICON 2017
Y2 - 25 October 2017 through 28 October 2017
ER -