Structural topology optimization with strength and heat conduction constraints

Akihiro Takezawa*, Gil Ho Yoon, Seung Hyun Jeong, Makoto Kobashi, Mitsuru Kitamura

*この研究の対応する著者

研究成果: Article査読

88 被引用数 (Scopus)

抄録

In this research, a topology optimization with constraints of structural strength and thermal conductivity is proposed. The coupled static linear elastic and heat conduction equations of state are considered. The optimization problem was formulated; viz., minimizing the volume under the constraints of p-norm stress and thermal compliance introducing the qp-relaxation method to avoid the singularity of stress-constraint topology optimization. The proposed optimization methodology is implemented employing the commonly used solid isotropic material with penalization (SIMP) method of topology optimization. The density function is updated using sequential linear programming (SLP) in the early stage of optimization. In the latter stage of optimization, the phase field method is employed to update the density function and obtain clear optimal shapes without intermediate densities. Numerical examples are provided to illustrate the validity and utility of the proposed methodology. Through these numerical studies, the dependency of the optima to the target temperature range due to the thermal expansion is confirmed. The issue of stress concentration due to the thermal expansion problem in the use of the structure in a wide temperature range is also clarified, and resolved by introducing a multi-stress constraint corresponding to several thermal conditions.

本文言語English
ページ(範囲)341-361
ページ数21
ジャーナルComputer Methods in Applied Mechanics and Engineering
276
DOI
出版ステータスPublished - 2014 7月 1
外部発表はい

ASJC Scopus subject areas

  • 計算力学
  • 材料力学
  • 機械工学
  • 物理学および天文学(全般)
  • コンピュータ サイエンスの応用

フィンガープリント

「Structural topology optimization with strength and heat conduction constraints」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル