@inproceedings{c10d65bb3e7a49bd96b5715fe87e3878,
title = "Study of Atomic Layer Deposition of hafnium oxide as an insulation layer on Cu for potential flip chip integration",
abstract = "Ultra thin films of hafnium oxide were deposited on copper using Atomic Layer Deposition. The physical insulation provided by the film was tested using Neutral Salt Spray testing. We examine the role of the thin film in preventing the oxidation of Cu.",
keywords = "Atomic layer deposition, Cu oxidation, Insulation, Thin films",
author = "Kawai, {Alaric Yohei} and Shingo Kataza and Shuichi Shoji and Jun Mizuno",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 10th IEEE CPMT Symposium Japan, ICSJ 2021 ; Conference date: 10-11-2021 Through 12-11-2021",
year = "2021",
doi = "10.1109/ICSJ52620.2021.9648884",
language = "English",
series = "2021 IEEE CPMT Symposium Japan, ICSJ 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "94--97",
booktitle = "2021 IEEE CPMT Symposium Japan, ICSJ 2021",
}