Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki; H. Shinohara; H. Kobayashi; J. Mizuno; S. Shoji

doi:10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki^*, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

^*この研究の対応する著者

研究成果: Conference contribution

3 被引用数 (Scopus)

本文言語	English
ホスト出版物のタイトル	2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
ページ	747-748
ページ数	2
DOI	https://doi.org/10.1115/MicroNano2008-70064
出版ステータス	Published - 2008 12月 1
イベント	2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong 継続期間: 2008 6月 3 → 2008 6月 5

出版物シリーズ

名前	2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference	2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
国/地域	Hong Kong
City	Kowloon
Period	08/6/3 → 08/6/5

ASJC Scopus subject areas

バイオテクノロジー
電子工学および電気工学

文献へのアクセス

10.1115/MicroNano2008-70064

他のファイルとリンク

引用スタイル

Kurotaki, H., Shinohara, H., Kobayashi, H., Mizuno, J., & Shoji, S. (2008). Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 (pp. 747-748). (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008). https://doi.org/10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique. / Kurotaki, H.; Shinohara, H.; Kobayashi, H. その他.
2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748 (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008).

研究成果: Conference contribution

Kurotaki, H, Shinohara, H, Kobayashi, H, Mizuno, J & Shoji, S 2008, Study of low-temperature wafer bonding with Au-Au bonding technique. in 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, pp. 747-748, 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, Kowloon, Hong Kong, 08/6/3. https://doi.org/10.1115/MicroNano2008-70064

Kurotaki H, Shinohara H, Kobayashi H, Mizuno J, Shoji S. Study of low-temperature wafer bonding with Au-Au bonding technique. In 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748. (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008). doi: 10.1115/MicroNano2008-70064

Kurotaki, H. ; Shinohara, H. ; Kobayashi, H. その他. / Study of low-temperature wafer bonding with Au-Au bonding technique. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. pp. 747-748 (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008).

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