抄録
Void distribution measurements were performed to clarify the void behaviour phenomena in a rod bundle with a nonuniform rod gap. An X-ray computed tomography scanner was applied for the void distribution measurement in the rod bundle. The test results show that the void concentrates on the wider subchannel due to void drift and the void distribution becomes flatter with increasing quality. The vapour velocity at the wide subchannel becomes larger and the slip ratio between vapour and liquid increases compared with a uniform rod gap. Therefore, the average void fraction of the bundle is reduced.
| 本文言語 | English |
|---|---|
| ホスト出版物のタイトル | 4th World Congress in Industrial Process Tomography |
| 出版社 | International Society for Industrial Process Tomography |
| ページ | 273-278 |
| ページ数 | 6 |
| ISBN（印刷版） | 9780853163206 |
| 出版ステータス | Published - 2005 |
| 外部発表 | はい |
| イベント | 4th World Congress in Industrial Process Tomography - Aizu 継続期間: 2005 9月 5 → 2005 9月 5 |
Other
| Other | 4th World Congress in Industrial Process Tomography |
|---|---|
| City | Aizu |
| Period | 05/9/5 → 05/9/5 |
ASJC Scopus subject areas
- 制御およびシステム工学
- 計算力学
- コンピュータ ビジョンおよびパターン認識
- コンピュータ サイエンスの応用