@inproceedings{56d60d8cc1e1459e87a28fc4e3c5ff16,
title = "Surface Activated Bonding Method for Low Temperature Bonding",
abstract = "The surface activated bonding (SAB) method for low temperature bonding: its development for heterogeneous and 3D integration is reviewed. The standard SAB method is based on surface bombardment by Ar beam in ultra-high vacuum to clean the surfaces so that they can be bonded very strongly at room temperature without heat treatment. Modifications of the surface activation have been investigated to extend the standard SAB method for various materials and applications.",
keywords = "bonding, interface, room-temperature bonding, SAB, surface activated bonding, surface activation",
author = "Tadatomo Suga and Fengwen Mu",
year = "2018",
month = nov,
day = "26",
doi = "10.1109/ESTC.2018.8546367",
language = "English",
series = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
note = "7th Electronic System-Integration Technology Conference, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",
}