TY - GEN
T1 - The effect of solid-state nanoporous Cu bonding for power device
AU - Park, Byungho
AU - le Han, Duy
AU - Saito, Mikiko
AU - Mizuno, Jun
AU - Nishikawa, Hiroshi
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/12
Y1 - 2021/5/12
N2 - Recently, the sintered nanoparticle has received an attention as a replacement for high temperature lead-based solder in the electronic device packaging due to its great thermal conductivity, mechanical properties and high melting temperature. However, there are still some problems such as controlling the thickness and the formation of unexpected voids caused by evaporation of solvent. In this study, nanoporous Cu (NPC) bonding process was developed to achieve a Cu-Cu bonding without solvent and flux. NPC sheet was fabricated by dealloying from cold-rolled Mn-Cu precursor. The effect of bonding temperatures (200–400 °C), pressure (2.5–20 MPa), and atmospheres (N2 and formic acid) on the joint strength of NPC bonding was investigated. The bonding mechanism was investigated by fracture surface of NPC bonding, as well as cross-sectional sample. These results revealed that the NPC bonding was closely related with the oxide layer formed on the NPC surface due to the interruption of diffusion between NPC and substrate.
AB - Recently, the sintered nanoparticle has received an attention as a replacement for high temperature lead-based solder in the electronic device packaging due to its great thermal conductivity, mechanical properties and high melting temperature. However, there are still some problems such as controlling the thickness and the formation of unexpected voids caused by evaporation of solvent. In this study, nanoporous Cu (NPC) bonding process was developed to achieve a Cu-Cu bonding without solvent and flux. NPC sheet was fabricated by dealloying from cold-rolled Mn-Cu precursor. The effect of bonding temperatures (200–400 °C), pressure (2.5–20 MPa), and atmospheres (N2 and formic acid) on the joint strength of NPC bonding was investigated. The bonding mechanism was investigated by fracture surface of NPC bonding, as well as cross-sectional sample. These results revealed that the NPC bonding was closely related with the oxide layer formed on the NPC surface due to the interruption of diffusion between NPC and substrate.
KW - Cold-rolling
KW - Die-attachment
KW - Diffusion
KW - Nanoporous
KW - Power device
UR - http://www.scopus.com/inward/record.url?scp=85113341888&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85113341888&partnerID=8YFLogxK
U2 - 10.23919/ICEP51988.2021.9451968
DO - 10.23919/ICEP51988.2021.9451968
M3 - Conference contribution
AN - SCOPUS:85113341888
T3 - 2021 International Conference on Electronics Packaging, ICEP 2021
SP - 159
EP - 160
BT - 2021 International Conference on Electronics Packaging, ICEP 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronics Packaging, ICEP 2021
Y2 - 12 May 2021 through 14 May 2021
ER -