Thermal-Aware floorplanning for noc-sprinting

Engineering & Materials Science

• Network-on-chip 100%
• Simulated annealing 89%
• Silicon 69%
• Wire 66%
• Heat problems 59%
• Hot Temperature 42%
• Program processors 37%
• Temperature 35%
• Heat transfer 29%

Chemical Compounds

• Annealing 69%
• Length 52%
• Heat Transfer 47%
• Time 15%