TY - GEN
T1 - Thermal characteristic evaluation and transient thermal analysis of next-generation sic power module at 250 °C
AU - Imakiire, Akihiro
AU - Kozako, Masahiro
AU - Hikta, Masayuki
AU - Tatsumi, Kohei
AU - Inagaki, Masakazu
AU - Iizuka, Tomonori
AU - Narimatsu, Hiroaki
AU - Sato, Nobuaki
AU - Shimizu, Koji
AU - Ueda, Kazutoshi
AU - Sugiura, Kazuhiko
AU - Tsuruta, Kazuhiro
AU - Iida, Makio
AU - Toda, Keiji
N1 - Funding Information:
This work was supported by the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), and “Next-generation power electronics/ Research and development of packaging technology for high temperature resistant SiC module of hybrid automobile of next-generation SiC power electronics” (funding agency: NEDO). We acknowledge TPEC greatly for supplying the SiC devices.
Publisher Copyright:
© 2018 VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2018
Y1 - 2018
N2 - In recent years, the demand for the operation of SiC power modules under high temperatures has emerged. The authors have so far investigated prototype SiC power modules using Ni micro plating bonding [NMPB] for junction temperatures driven at 250 °C. This paper presents the thermal characteristics and transient thermal analysis of a prototype novel SiC power module using NMPB, and compares with those of the conventional structure power module using high-temperature solder. Furthermore, we attempt to estimate and analyze the thermal resistance in a power module using a structure function derived from transient thermal analysis to discuss the delamination or void formation caused by a power cycling test.
AB - In recent years, the demand for the operation of SiC power modules under high temperatures has emerged. The authors have so far investigated prototype SiC power modules using Ni micro plating bonding [NMPB] for junction temperatures driven at 250 °C. This paper presents the thermal characteristics and transient thermal analysis of a prototype novel SiC power module using NMPB, and compares with those of the conventional structure power module using high-temperature solder. Furthermore, we attempt to estimate and analyze the thermal resistance in a power module using a structure function derived from transient thermal analysis to discuss the delamination or void formation caused by a power cycling test.
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M3 - Conference contribution
AN - SCOPUS:85072812223
T3 - CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
SP - 174
EP - 179
BT - CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
PB - VDE VERLAG GMBH
T2 - 10th International Conference on Integrated Power Electronics Systems, CIPS 2018
Y2 - 20 March 2018 through 22 March 2018
ER -