Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu; Junya Katoh; Fumiaki Suzuki; Mitsutoshi Jikei; Kimihisa Yamamoto; Hiroyuki Nishide; Eishun Tsuchida

doi:10.1002/pat.1991.220020307

Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

Kenichi Oyaizu^*, Junya Katoh, Fumiaki Suzuki, Mitsutoshi Jikei, Kimihisa Yamamoto, Hiroyuki Nishide, Eishun Tsuchida

^*この研究の対応する著者

先進理工学部

研究成果: Article › 査読

7 被引用数 (Scopus)

抄録

Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td_10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

本文言語	English
ページ（範囲）	155-159
ページ数	5
ジャーナル	Polymers for Advanced Technologies
巻	2
号	3
DOI	https://doi.org/10.1002/pat.1991.220020307
出版ステータス	Published - 1991 6月

ASJC Scopus subject areas

ポリマーおよびプラスチック

文献へのアクセス

10.1002/pat.1991.220020307

他のファイルとリンク

引用スタイル

@article{ee096e211a19494c8365f3225f7e06e8,

title = "Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond",

abstract = "Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.",

keywords = "Disulfide, Oligo(phenylene sulfide), Thermolysis",

author = "Kenichi Oyaizu and Junya Katoh and Fumiaki Suzuki and Mitsutoshi Jikei and Kimihisa Yamamoto and Hiroyuki Nishide and Eishun Tsuchida",

year = "1991",

month = jun,

doi = "10.1002/pat.1991.220020307",

language = "English",

volume = "2",

pages = "155--159",

journal = "Polymers for Advanced Technologies",

issn = "1042-7147",

publisher = "John Wiley and Sons Ltd",

number = "3",

}

TY - JOUR

T1 - Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

AU - Oyaizu, Kenichi

AU - Katoh, Junya

AU - Suzuki, Fumiaki

AU - Jikei, Mitsutoshi

AU - Yamamoto, Kimihisa

AU - Nishide, Hiroyuki

AU - Tsuchida, Eishun

PY - 1991/6

Y1 - 1991/6

N2 - Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

AB - Oligo(phenylene sulfide) (OPS) containing one disulfide bond at the end of the chain, which was obtained by the oxidative polymerization of diphenyl disulfide, had a relatively low Td10%(temperature for 10% weight loss) of 412 °C because of degradation of the disulfide bond. But this thermal cleavage of the disulfide bond promoted the curing reaction through thiophenoxy radical formation. OPS was allowed to react with diiodobenzene at 220 °C. The thermal stability of OPS was improved through the consumption of the disulfide bond and the coupling of the chain.

KW - Disulfide

KW - Oligo(phenylene sulfide)

KW - Thermolysis

UR - http://www.scopus.com/inward/record.url?scp=84994945161&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84994945161&partnerID=8YFLogxK

U2 - 10.1002/pat.1991.220020307

DO - 10.1002/pat.1991.220020307

M3 - Article

AN - SCOPUS:84994945161

SN - 1042-7147

VL - 2

SP - 155

EP - 159

JO - Polymers for Advanced Technologies

JF - Polymers for Advanced Technologies

IS - 3

ER -

Thermolysis of reactive oligo(p‐phenylene sulfide) containing disulfide bond

抄録

ASJC Scopus subject areas

文献へのアクセス

他のファイルとリンク

フィンガープリント

引用スタイル